Chieh-Fang Chen
35Patents
8h-index
40Co-inventors
71Inventor score
Filing activity: Feb 23, 2006 → Aug 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8138028B2 | Method for manufacturing a phase change memory device with pillar bottom electrode | Electricity | 21 | Active |
| US7879645B2 | Fill-in etching free pore device | Electricity | 21 | Active |
| US7884343B2 | Phase change memory cell with filled sidewall memory element and method for fabricating the same | Electricity | 14 | Active |
| US8324605B2 | Dielectric mesh isolated phase change structure for phase change memory | Electricity | 14 | Active |
| US7701750B2 | Phase change device having two or more substantial amorphous regions in high resistance state | Electricity | 14 | Active |
| US8363463B2 | Phase change memory having one or more non-constant doping profiles | Physics | 13 | Active |
| US8426242B2 | Composite target sputtering for forming doped phase change materials | Electricity | 11 | Active |
| US7932507B2 | Current constricting phase change memory element structure | Electricity | 10 | Active |
| US8772747B2 | Composite target sputtering for forming doped phase change materials | Electricity | 8 | Active |
| US7745807B2 | Current constricting phase change memory element structure | Electricity | 8 | Active |
| US7510929B2 | Method for making memory cell device | Electricity | 7 | Active |
| US8378328B2 | Phase change memory random access device using single-element phase change material | Physics | 4 | Active |
| US7491573B1 | Phase change materials for applications that require fast switching and high endurance | Electricity | 4 | Active |
| US8779408B2 | Phase change memory cell structure | Electricity | 3 | Active |
| US8064247B2 | Rewritable memory device based on segregation/re-absorption | Physics | 3 | Active |
| US9330764B2 | Array fanout pass transistor structure | Electricity | 3 | Active |
| US8198619B2 | Phase change memory cell structure | Electricity | 3 | Active |
| US7514367B2 | Method for manufacturing a narrow structure on an integrated circuit | Emerging Cross-Sectional Technologies | 3 | Active |
| US8445313B2 | Method for forming a self-aligned bit line for PCRAM and self-aligned etch back process | Electricity | 2 | Active |
| US7897954B2 | Dielectric-sandwiched pillar memory device | Physics | 2 | Active |
| US8623734B2 | Method to selectively grow phase change material inside a via hole | Electricity | 2 | Active |
| US10811427B1 | Semiconductor structure and manufacturing method thereof | Electricity | 2 | Active |
| US8263960B2 | Phase change memory cell with filled sidewall memory element and method for fabricating the same | Electricity | 1 | Active |
| US8273598B2 | Method for forming a self-aligned bit line for PCRAM and self-aligned etch back process | Electricity | 1 | Active |
| US7483316B2 | Method and apparatus for refreshing programmable resistive memory | Physics | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.