Inventor · Tainan, TW

Ching-Chung Su

29Patents
3h-index
46Co-inventors
59Inventor score

Filing activity: Dec 18, 2007 → Jul 28, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10163974B2 Method of forming absorption enhancement structure for image sensor Electricity 13 Active
US10304898B2 Absorption enhancement structure for image sensor Electricity 9 Active
US9293392B2 3DIC interconnect apparatus and method Electricity 4 Active
US10847564B1 Charge release layer to remove charge carriers from dielectric grid structures in image sensors Electricity 2 Active
US9991303B2 Image sensor device structure Electricity 1 Active
US9337225B2 Semiconductor device and manufacturing method thereof Electricity 1 Active
US9984918B2 Semiconductor structure and manufacturing method thereof Electricity 1 Active
US11430909B2 BSI chip with backside alignment mark Electricity 1 Active
US10784150B2 Semiconductor structure and manufacturing method thereof Electricity 1 Active
US10510799B2 Absorption enhancement structure for image sensor Electricity 1 Active
US12218160B2 Pixel sensor including a layer stack to reduce and/or block the effects of plasma processing and etching on the pixel sensor Electricity 0 Active
US11948962B2 Charge release layer to remove charge carriers from dielectric grid structures in image sensors Electricity 0 Active
US12154939B2 High capacitance MIM device with self aligned spacer Electricity 0 Active
US10840287B2 3DIC interconnect apparatus and method Electricity 0 Active
US8049213B2 Feature dimension measurement Electricity 0 Active
US12183753B2 Image sensor and method of making Electricity 0 Active
US11769791B2 High capacitance MIM device with self aligned spacer Electricity 0 Active
US12094997B2 BSI chip with backside alignment mark Electricity 0 Active
US10361234B2 3DIC interconnect apparatus and method Electricity 0 Active
US10804315B2 Absorption enhancement structure for image sensor Electricity 0 Active
US11164903B2 Image sensor with pad structure Electricity 0 Active
US10276427B2 Semiconductor structure and manufacturing method thereof Electricity 0 Active
US11990488B2 Grid structure with at least partially angled sidewalls Electricity 0 Active
US8987033B2 Method for forming CMOS image sensors Electricity 0 Active
US11380728B2 Charge release layer to remove charge carriers from dielectric grid structures in image sensors Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.