Inventor · Singapore, SG

Elgin Quek

152Patents
21h-index
85Co-inventors
93Inventor score

Filing activity: Feb 27, 1995 → Aug 17, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US6300177A Method to form transistors with multiple threshold voltages (VT) using a combination of different work function gate materials Electricity 160 Expired
US7169675B2 Material architecture for the fabrication of low temperature transistor Electricity 149 Expired
US7867835B2 Integrated circuit system for suppressing short channel effects Electricity 115 Active
US6461900B1 Method to form a self-aligned CMOS inverter using vertical device integration Electricity 92 Expired
US6946349B1 Method for integrating a SONOS gate oxide transistor into a logic/analog integrated circuit having several gate oxide thicknesses Emerging Cross-Sectional Technologies 80 Expired
US6747314B2 Method to form a self-aligned CMOS inverter using vertical device integration Electricity 72 Expired
US7592270B2 Modulation of stress in stress film through ion implantation and its application in stress memorization technique Electricity 53 Active
US6632712B1 Method of fabricating variable length vertical transistors Electricity 49 Expired
US6313008A Method to form a balloon shaped STI using a micro machining technique to remove heavily doped silicon Electricity 45 Expired
US6403485B1 Method to form a low parasitic capacitance pseudo-SOI CMOS device Electricity 38 Expired
US8440533B2 Self-aligned contact for replacement metal gate and silicide last processes Electricity 31 Active
US5488244A Electrically erasable and programmable read only memory cell Electricity 30 Expired
US6406945B1 Method for forming a transistor gate dielectric with high-K and low-K regions Emerging Cross-Sectional Technologies 30 Expired
US6417056B1 Method to form low-overlap-capacitance transistors by forming microtrench at the gate edge Electricity 30 Expired
US6306715A Method to form smaller channel with CMOS device by isotropic etching of the gate materials Electricity 27 Expired
US6468877B1 Method to form an air-gap under the edges of a gate electrode by using disposable spacer/liner Electricity 25 Expired
US6468851B1 Method of fabricating CMOS device with dual gate electrode Electricity 24 Expired
US6436770B1 Method to control the channel length of a vertical transistor by first forming channel using selective epi and source/drain using implantation Electricity 22 Expired
US8492235B2 FinFET with stressors Electricity 22 Active
US6511884B1 Method to form and/or isolate vertical transistors Electricity 22 Expired
US8502279B2 Nano-electro-mechanical system (NEMS) structures with actuatable semiconductor fin on bulk substrates Electricity 21 Active
US8368127B2 Method of fabricating a silicon tunneling field effect transistor (TFET) with high drive current Electricity 18 Active
US9673388B2 Integrated circuit structures with spin torque transfer magnetic random access memory and methods for fabricating the same Electricity 15 Active
US6277710A Method of forming shallow trench isolation Electricity 14 Expired
US8889494B2 Finfet Electricity 13 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.