Elgin Quek
152Patents
21h-index
85Co-inventors
93Inventor score
Filing activity: Feb 27, 1995 → Aug 17, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6300177A | Method to form transistors with multiple threshold voltages (VT) using a combination of different work function gate materials | Electricity | 160 | Expired |
| US7169675B2 | Material architecture for the fabrication of low temperature transistor | Electricity | 149 | Expired |
| US7867835B2 | Integrated circuit system for suppressing short channel effects | Electricity | 115 | Active |
| US6461900B1 | Method to form a self-aligned CMOS inverter using vertical device integration | Electricity | 92 | Expired |
| US6946349B1 | Method for integrating a SONOS gate oxide transistor into a logic/analog integrated circuit having several gate oxide thicknesses | Emerging Cross-Sectional Technologies | 80 | Expired |
| US6747314B2 | Method to form a self-aligned CMOS inverter using vertical device integration | Electricity | 72 | Expired |
| US7592270B2 | Modulation of stress in stress film through ion implantation and its application in stress memorization technique | Electricity | 53 | Active |
| US6632712B1 | Method of fabricating variable length vertical transistors | Electricity | 49 | Expired |
| US6313008A | Method to form a balloon shaped STI using a micro machining technique to remove heavily doped silicon | Electricity | 45 | Expired |
| US6403485B1 | Method to form a low parasitic capacitance pseudo-SOI CMOS device | Electricity | 38 | Expired |
| US8440533B2 | Self-aligned contact for replacement metal gate and silicide last processes | Electricity | 31 | Active |
| US5488244A | Electrically erasable and programmable read only memory cell | Electricity | 30 | Expired |
| US6406945B1 | Method for forming a transistor gate dielectric with high-K and low-K regions | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6417056B1 | Method to form low-overlap-capacitance transistors by forming microtrench at the gate edge | Electricity | 30 | Expired |
| US6306715A | Method to form smaller channel with CMOS device by isotropic etching of the gate materials | Electricity | 27 | Expired |
| US6468877B1 | Method to form an air-gap under the edges of a gate electrode by using disposable spacer/liner | Electricity | 25 | Expired |
| US6468851B1 | Method of fabricating CMOS device with dual gate electrode | Electricity | 24 | Expired |
| US6436770B1 | Method to control the channel length of a vertical transistor by first forming channel using selective epi and source/drain using implantation | Electricity | 22 | Expired |
| US8492235B2 | FinFET with stressors | Electricity | 22 | Active |
| US6511884B1 | Method to form and/or isolate vertical transistors | Electricity | 22 | Expired |
| US8502279B2 | Nano-electro-mechanical system (NEMS) structures with actuatable semiconductor fin on bulk substrates | Electricity | 21 | Active |
| US8368127B2 | Method of fabricating a silicon tunneling field effect transistor (TFET) with high drive current | Electricity | 18 | Active |
| US9673388B2 | Integrated circuit structures with spin torque transfer magnetic random access memory and methods for fabricating the same | Electricity | 15 | Active |
| US6277710A | Method of forming shallow trench isolation | Electricity | 14 | Expired |
| US8889494B2 | Finfet | Electricity | 13 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.