Inventor · Slingerlands, NY, US

Yann Mignot

120Patents
8h-index
110Co-inventors
79Inventor score

Filing activity: Jul 25, 2013 → Sep 16, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US10020254B1 Integration of super via structure in BEOL Electricity 25 Active
US8927442B1 SiCOH hardmask with graded transition layers Electricity 24 Active
US10020255B1 Integration of super via structure in BEOL Electricity 18 Active
US9385078B1 Self aligned via in integrated circuit Electricity 11 Active
US10157789B2 Via formation using sidewall image transfer process to define lateral dimension Electricity 10 Active
US10304744B1 Inverse tone direct print EUV lithography enabled by selective material deposition Electricity 9 Active
US9984919B1 Inverted damascene interconnect structures Electricity 9 Active
US9390967B2 Method for residue-free block pattern transfer onto metal interconnects for air gap formation Electricity 8 Active
US9779944B1 Method and structure for cut material selection Electricity 8 Active
US9490168B1 Via formation using sidewall image transfer process to define lateral dimension Electricity 8 Active
US9373582B1 Self aligned via in integrated circuit Electricity 7 Active
US9466563B2 Interconnect structure for an integrated circuit and method of fabricating an interconnect structure Electricity 6 Active
US10103022B2 Alternating hardmasks for tight-pitch line formation Emerging Cross-Sectional Technologies 6 Active
US10361129B1 Self-aligned double patterning formed fincut Electricity 6 Active
US10658180B1 EUV pattern transfer with ion implantation and reduced impact of resist residue Electricity 5 Active
US9679899B2 Co-integration of tensile silicon and compressive silicon germanium Electricity 4 Active
US10586732B2 Via cleaning to reduce resistance Electricity 4 Active
US9214429B2 Trench interconnect having reduced fringe capacitance Electricity 4 Active
US10622301B2 Method of forming a straight via profile with precise critical dimension control Electricity 4 Active
US9837351B1 Avoiding gate metal via shorting to source or drain contacts Electricity 3 Active
US10410875B2 Alternating hardmasks for tight-pitch line formation Electricity 3 Active
US10672705B2 Method of forming a straight via profile with precise critical dimension control Electricity 3 Active
US10361125B2 Methods and structures for forming uniform fins when using hardmask patterns Electricity 3 Active
US10032632B2 Selective gas etching for self-aligned pattern transfer Electricity 3 Active
US10276434B1 Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.