Inventor · Niskayuna, NY, US

Yongan Xu

88Patents
9h-index
72Co-inventors
77Inventor score

Filing activity: Feb 16, 2006 → Mar 21, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US10020254B1 Integration of super via structure in BEOL Electricity 25 Active
US9219007B2 Double self aligned via patterning Electricity 24 Active
US10020255B1 Integration of super via structure in BEOL Electricity 18 Active
US7901607B2 Method of low temperature imprinting process with high pattern transfer yield Emerging Cross-Sectional Technologies 15 Active
US9257334B2 Double self-aligned via patterning Electricity 13 Active
US9064813B2 Trench patterning with block first sidewall image transfer Electricity 13 Active
US10157789B2 Via formation using sidewall image transfer process to define lateral dimension Electricity 10 Active
US9991365B1 Forming vertical transport field effect transistors with uniform bottom spacer thickness Electricity 10 Active
US9984919B1 Inverted damascene interconnect structures Electricity 9 Active
US9490168B1 Via formation using sidewall image transfer process to define lateral dimension Electricity 8 Active
US10658180B1 EUV pattern transfer with ion implantation and reduced impact of resist residue Electricity 5 Active
US10622301B2 Method of forming a straight via profile with precise critical dimension control Electricity 4 Active
US10749011B2 Area selective cyclic deposition for VFET top spacer Electricity 3 Active
US10607922B1 Controlling via critical dimension during fabrication of a semiconductor wafer Electricity 3 Active
US9406746B2 Work function metal fill for replacement gate fin field effect transistor process Electricity 3 Active
US9837351B1 Avoiding gate metal via shorting to source or drain contacts Electricity 3 Active
US10672705B2 Method of forming a straight via profile with precise critical dimension control Electricity 3 Active
US10032632B2 Selective gas etching for self-aligned pattern transfer Electricity 3 Active
US11610925B2 Imaging system and method of creating composite images Physics 2 Active
US11699591B2 Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic Electricity 2 Active
US10032633B1 Image transfer using EUV lithographic structure and double patterning process Electricity 2 Active
US9330965B2 Double self aligned via patterning Electricity 2 Active
US8298467B2 Method of low temperature imprinting process with high pattern transfer yield Emerging Cross-Sectional Technologies 1 Active
US11037822B2 Svia using a single damascene interconnect Electricity 1 Active
US11111176B1 Methods and apparatus of processing transparent substrates Chemistry; Metallurgy 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.