Huan-Chieh Su
133Patents
4h-index
61Co-inventors
67Inventor score
Filing activity: Aug 20, 2008 → Jun 21, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11222892B2 | Backside power rail and methods of forming the same | Electricity | 10 | Active |
| US9312186B1 | Method of forming horizontal gate all around structure | Electricity | 7 | Active |
| US11233005B1 | Method for manufacturing an anchor-shaped backside via | Electricity | 6 | Active |
| US11443987B2 | Semiconductor devices with backside air gap dielectric | Electricity | 6 | Active |
| US7858147B2 | Interconnect structure and method of fabricating the same | Emerging Cross-Sectional Technologies | 4 | Active |
| US11195930B1 | Semiconductor devices with backside power rail and methods of fabrication thereof | Electricity | 4 | Active |
| US10388771B1 | Method and device for forming cut-metal-gate feature | Electricity | 4 | Active |
| US11114529B2 | Gate-all-around field-effect transistor device | Electricity | 3 | Active |
| US10002796B1 | Dual epitaxial growth process for semiconductor device | Electricity | 3 | Active |
| US11349004B2 | Backside vias in semiconductor device | Electricity | 3 | Active |
| US11532713B2 | Source/drain contacts and methods of forming same | Electricity | 3 | Active |
| US11581224B2 | Method for forming long channel back-side power rail device | Electricity | 3 | Active |
| US11502201B2 | Semiconductor device with backside power rail and methods of fabrication thereof | Electricity | 2 | Active |
| US11456209B2 | Spacers for semiconductor devices including a backside power rails | Electricity | 2 | Active |
| US11450751B2 | Integrated circuit structure with backside via rail | Electricity | 2 | Active |
| US8609981B2 | P-type transparent conductive oxide for solar cell comprising molybdenum trioxide doped with indium | Emerging Cross-Sectional Technologies | 2 | Active |
| US10374058B2 | Semiconductor device and method for manufacturing the same | Electricity | 2 | Active |
| US11551969B2 | Integrated circuit structure with backside interconnection structure having air gap | Electricity | 2 | Active |
| US10930763B2 | Method and device for forming metal gate electrodes for transistors | Electricity | 2 | Active |
| US9786757B2 | Method of forming horizontal gate all around structure | Electricity | 2 | Active |
| US11482595B1 | Dual side contact structures in semiconductor devices | Electricity | 1 | Active |
| US11929413B2 | Semiconductor device structure with metal gate stack | Electricity | 1 | Active |
| US10679856B2 | Fin field effect transistor (FinFET) device structure with insulating structure over fin isolation structure and method for forming the same | Electricity | 1 | Active |
| US11658226B2 | Backside gate contact | Electricity | 1 | Active |
| US12009394B2 | Source/drain contacts and methods of forming same | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.