Mark V. Raymond
32Patents
7h-index
73Co-inventors
72Inventor score
Filing activity: Feb 28, 1997 → Jan 31, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6096127A | Tuneable dielectric films having low electrical losses | Electricity | 126 | Expired |
| US6576967B1 | Semiconductor structure and process for forming a metal oxy-nitride dielectric layer | Electricity | 16 | Expired |
| US10157794B1 | Integrated circuit structure with stepped epitaxial region | Electricity | 11 | Active |
| US9721889B1 | Middle of the line (MOL) metal contacts | Electricity | 10 | Active |
| US6518070B1 | Process of forming a semiconductor device and a semiconductor device | Electricity | 9 | Expired |
| US7655550B2 | Method of making metal gate transistors | Electricity | 8 | Active |
| US9147765B2 | FinFET semiconductor devices with improved source/drain resistance and methods of making same | Electricity | 7 | Active |
| US9184263B2 | Methods of forming gate structures for semiconductor devices using a replacement gate technique and the resulting devices | Electricity | 5 | Active |
| US9947589B1 | Methods of forming a gate contact for a transistor above an active region and the resulting device | Electricity | 5 | Active |
| US9142633B2 | Integrated circuits and methods for fabricating integrated circuits with silicide contacts on non-planar structures | Electricity | 5 | Active |
| US10204994B2 | Methods of forming a semiconductor device with a gate contact positioned above the active region | Electricity | 4 | Active |
| US10580696B1 | Interconnects formed by a metal displacement reaction | Electricity | 3 | Active |
| US10593593B2 | Methods, apparatus, and system for protecting cobalt formations from oxidation during semiconductor device formation | Electricity | 1 | Active |
| US6743668B2 | Process for forming a metal oxy-nitride dielectric layer by varying the flow rate of nitrogen into the chamber | Electricity | 1 | Expired |
| US10854515B2 | Methods, apparatus, and system for protecting cobalt formations from oxidation during semiconductor device formation | Electricity | 0 | Active |
| US11031484B2 | Silicided gate structures | Electricity | 0 | Active |
| US10283372B2 | Interconnects formed by a metal replacement process | Electricity | 0 | Active |
| US11621333B2 | Gate contact structure for a transistor device | Electricity | 0 | Active |
| US9218975B2 | Methods of forming a replacement gate structure having a gate electrode comprised of a deposited intermetallic compound material | Electricity | 0 | Active |
| US9859217B1 | Middle of the line (MOL) metal contacts | Electricity | 0 | Active |
| US10727308B2 | Gate contact structure for a transistor | Electricity | 0 | Active |
| US8854067B2 | Circular transmission line methods compatible with combinatorial processing of semiconductors | Electricity | 0 | Active |
| US8652963B2 | MOSFET integrated circuit with uniformly thin silicide layer and methods for its manufacture | Electricity | 0 | Active |
| US10643894B2 | Surface area and Schottky barrier height engineering for contact trench epitaxy | Electricity | 0 | Active |
| US10026693B2 | Method, apparatus, and system for MOL interconnects without titanium liner | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.