Yi Ma
73Patents
19h-index
110Co-inventors
87Inventor score
Filing activity: Mar 12, 1992 → May 4, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6152987A | Hydrogen gas-extraction module and method of fabrication | Emerging Cross-Sectional Technologies | 339 | Expired |
| US6025280A | Use of SiD.sub.4 for deposition of ultra thin and controllable oxides | Electricity | 152 | Expired |
| US5940736A | Method for forming a high quality ultrathin gate oxide layer | Electricity | 144 | Expired |
| US6246095A | System and method for forming a uniform thin gate oxide layer | Electricity | 132 | Expired |
| US6011404A | System and method for determining near--surface lifetimes and the tunneling field of a dielectric in a semiconductor | Electricity | 96 | Expired |
| US6162711A | In-situ boron doped polysilicon with dual layer and dual grain structure for use in integrated circuits manufacturing | Electricity | 75 | Expired |
| US6320238A | Gate structure for integrated circuit fabrication | Electricity | 73 | Expired |
| US7910446B2 | Integrated scheme for forming inter-poly dielectrics for non-volatile memory devices | Electricity | 40 | Active |
| US5960302A | Method of making a dielectric for an integrated circuit | Electricity | 39 | Expired |
| US8043907B2 | Atomic layer deposition processes for non-volatile memory devices | Electricity | 38 | Active |
| US5258339A | Formation of zeolite membranes from sols | Performing Operations; Transporting | 37 | Expired |
| US7175694B2 | Composite gas separation modules having intermediate porous metal layers | Chemistry; Metallurgy | 34 | Expired |
| US6207586A | Oxide/nitride stacked gate dielectric and associated methods | Electricity | 33 | Expired |
| US6509242B2 | Heterojunction bipolar transistor | Electricity | 29 | Expired |
| US5908312A | Semiconductor device fabrication | Electricity | 27 | Expired |
| US6518622B1 | Vertical replacement gate (VRG) MOSFET with a conductive layer adjacent a source/drain region and method of manufacture therefor | Electricity | 21 | Expired |
| US6274490A | Method of manufacturing semiconductor devices having high pressure anneal | Electricity | 21 | Expired |
| US5814562A | Process for semiconductor device fabrication | Emerging Cross-Sectional Technologies | 21 | Expired |
| US8426839B1 | Conducting bridge random access memory (CBRAM) device structures | Electricity | 19 | Active |
| US7659158B2 | Atomic layer deposition processes for non-volatile memory devices | Electricity | 18 | Active |
| US6548854B1 | Compound, high-K, gate and capacitor insulator layer | Electricity | 18 | Expired |
| US6417570B1 | Layered dielectric film structure suitable for gate dielectric application in sub-0.25 &mgr;m technologies | Electricity | 17 | Expired |
| US7078302B2 | Gate electrode dopant activation method for semiconductor manufacturing including a laser anneal | Electricity | 17 | Expired |
| US5846871A | Integrated circuit fabrication | Electricity | 16 | Expired |
| US5981403A | Layered silicon nitride deposition process | Electricity | 15 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.