Bernhard Sell
87Patents
10h-index
102Co-inventors
81Inventor score
Filing activity: Oct 2, 2000 → Feb 16, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7041568B2 | Method for the production of a self-adjusted structure on a semiconductor wafer | Electricity | 197 | Expired |
| US6835417B2 | Method and device for depositing thin layers via ALD/CVD processes in combination with rapid thermal processes | Chemistry; Metallurgy | 103 | Expired |
| US7335959B2 | Device with stepped source/drain region profile | Electricity | 75 | Expired |
| US7732285B2 | Semiconductor device having self-aligned epitaxial source and drain extensions | Electricity | 40 | Active |
| US7663192B2 | CMOS device and method of manufacturing same | Electricity | 23 | Active |
| US8941214B2 | Semiconductor device having a necked semiconductor body and method of forming semiconductor bodies of varying width | Electricity | 17 | Active |
| US6620724B1 | Low resistivity deep trench fill for DRAM and EDRAM applications | Electricity | 16 | Expired |
| US7943469B2 | Multi-component strain-inducing semiconductor regions | Electricity | 16 | Active |
| US7768074B2 | Dual salicide integration for salicide through trench contacts and structures formed thereby | Electricity | 11 | Active |
| US7829943B2 | Low-k isolation spacers for conductive regions | Emerging Cross-Sectional Technologies | 10 | Active |
| US6633061B2 | SOI substrate, a semiconductor circuit formed in a SOI substrate, and an associated production method | Electricity | 10 | Expired |
| US7687364B2 | Low-k isolation spacers for conductive regions | Emerging Cross-Sectional Technologies | 9 | Active |
| US6800898B2 | Integrated circuit configuration and method of fabricating a dram structure with buried bit lines or trench capacitors | Electricity | 9 | Expired |
| US8803245B2 | Method of forming stacked trench contacts and structures formed thereby | Electricity | 8 | Active |
| US6504200B2 | DRAM cell configuration and fabrication method | Electricity | 6 | Expired |
| US11239238B2 | Thin film transistor based memory cells on both sides of a layer of logic devices | Electricity | 6 | Active |
| US6627940B1 | Memory cell arrangement | Electricity | 6 | Expired |
| US9559060B2 | Method of forming stacked trench contacts and structures formed thereby | Electricity | 5 | Active |
| US9922930B2 | Method of forming stacked trench contacts and structures formed thereby | Electricity | 5 | Active |
| US9437546B2 | Method of forming stacked trench contacts and structures formed thereby | Electricity | 5 | Active |
| US9252267B2 | Method of forming stacked trench contacts and structures formed thereby | Electricity | 5 | Active |
| US6674113B2 | Trench capacitor and method for manufacturing the same | Electricity | 4 | Expired |
| US6600680B2 | Circuit configuration and method for determining a time constant of a storage capacitor of a memory cell in a semiconductor memory | Physics | 4 | Expired |
| US10297549B2 | Method of forming stacked trench contacts and structures formed thereby | Electricity | 4 | Active |
| US6525363B1 | Integrated circuit configuration with at least one capacitor and method for producing the same | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.