Jody A. Fronheiser
49Patents
10h-index
67Co-inventors
74Inventor score
Filing activity: Aug 23, 2006 → Jun 6, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9343300B1 | Methods of forming source/drain regions for a PMOS transistor device with a germanium-containing channel region | Electricity | 24 | Active |
| US8673718B2 | Methods of forming FinFET devices with alternative channel materials | Electricity | 22 | Active |
| US8728885B1 | Methods of forming a three-dimensional semiconductor device with a nanowire channel structure | Electricity | 20 | Active |
| US9165837B1 | Method to form defect free replacement fins by H2 anneal | Electricity | 20 | Active |
| US8580642B1 | Methods of forming FinFET devices with alternative channel materials | Electricity | 19 | Active |
| US9362405B1 | Channel cladding last process flow for forming a channel region on a FinFET device | Electricity | 13 | Active |
| US7691711B2 | Method for fabricating silicon carbide vertical MOSFET devices | Electricity | 13 | Active |
| US7850941B2 | Nanostructure arrays and methods for forming same | Emerging Cross-Sectional Technologies | 13 | Active |
| US9224865B2 | FinFET with insulator under channel | Electricity | 11 | Active |
| US9117875B2 | Methods of forming isolated germanium-containing fins for a FinFET semiconductor device | Electricity | 11 | Active |
| US9716174B2 | Electrical isolation of FinFET active region by selective oxidation of sacrificial layer | Electricity | 9 | Active |
| US9236452B2 | Raised source/drain EPI with suppressed lateral EPI overgrowth | Electricity | 7 | Active |
| US7595241B2 | Method for fabricating silicon carbide vertical MOSFET devices | Electricity | 6 | Active |
| US9245980B2 | Methods of forming substantially defect-free, fully-strained silicon-germanium fins for a FinFET semiconductor device | Electricity | 5 | Active |
| US8853019B1 | Methods of forming a semiconductor device with a nanowire channel structure by performing an anneal process | Performing Operations; Transporting | 5 | Active |
| US8815685B2 | Methods for fabricating integrated circuits having confined epitaxial growth regions | Electricity | 4 | Active |
| US9324790B2 | Self-aligned dual-height isolation for bulk FinFET | Electricity | 4 | Active |
| US9647086B2 | Early PTS with buffer for channel doping control | Electricity | 4 | Active |
| US9564486B2 | Self-aligned dual-height isolation for bulk FinFET | Electricity | 4 | Active |
| US9478663B2 | FinFET device including a uniform silicon alloy fin | Electricity | 3 | Active |
| US9530869B2 | Methods of forming embedded source/drain regions on finFET devices | Electricity | 3 | Active |
| US9882052B2 | Forming defect-free relaxed SiGe fins | Electricity | 2 | Active |
| US9508848B1 | Methods of forming strained channel regions on FinFET devices by performing a heating process on a heat-expandable material | Electricity | 2 | Active |
| US7906427B2 | Dimension profiling of SiC devices | Emerging Cross-Sectional Technologies | 1 | Active |
| US9508853B2 | Channel cladding last process flow for forming a channel region on a FinFET device having a reduced size fin in the channel region | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.