Thomas Laidig
82Patents
12h-index
42Co-inventors
84Inventor score
Filing activity: May 3, 1995 → Feb 13, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7175940B2 | Method of two dimensional feature model calibration and optimization | Physics | 264 | Expired |
| US5663893A | Method for generating proximity correction features for a lithographic mask pattern | Electricity | 164 | Expired |
| US5821014A | Optical proximity correction method for intermediate-pitch features using sub-resolution scattering bars on a mask | Physics | 163 | Expired |
| US5887155A | Vertex based geometry engine system for use in integrated circuit design | Physics | 34 | Expired |
| US6670081B2 | Optical proximity correction method utilizing serifs having variable dimensions | Physics | 34 | Expired |
| US7247574B2 | Method and apparatus for providing optical proximity features to a reticle pattern for deep sub-wavelength optical lithography | Physics | 32 | Expired |
| US6851103B2 | Method and apparatus for decomposing semiconductor device patterns into phase and chrome regions for chromeless phase lithography | Physics | 26 | Expired |
| US6623895B2 | Hybrid phase-shift mask | Physics | 21 | Expired |
| US7398508B2 | Eigen decomposition based OPC model | Physics | 19 | Expired |
| US7550235B2 | Method and apparatus for performing model based placement of phase-balanced scattering bars for sub-wavelength optical lithography | Physics | 18 | Active |
| US7231629B2 | Feature optimization using enhanced interference mapping lithography | Physics | 14 | Expired |
| US9025136B2 | System and method for manufacturing three dimensional integrated circuits | Physics | 12 | Active |
| US8132130B2 | Method, program product and apparatus for performing mask feature pitch decomposition for use in a multiple exposure process | Physics | 12 | Active |
| US6951701B2 | Method for improved lithographic patterning utilizing multiple coherency optimized exposures and high transmission attenuated PSM | Physics | 12 | Expired |
| US8390781B2 | Optical imaging writer system | Physics | 10 | Active |
| US7820341B2 | Method of two dimensional feature model calibration and optimization | Physics | 10 | Active |
| US7523438B2 | Method for improved lithographic patterning utilizing optimized illumination conditions and high transmission attenuated PSM | Physics | 10 | Active |
| US8390786B2 | Optical imaging writer system | Physics | 10 | Active |
| US7355681B2 | Optical proximity correction using chamfers and rounding at corners | Physics | 9 | Expired |
| US7434195B2 | Method for performing full-chip manufacturing reliability checking and correction | Physics | 9 | Expired |
| US8670106B2 | Optical imaging writer system | Physics | 9 | Active |
| US8253923B1 | Optical imaging writer system | Physics | 7 | Active |
| US6835510B2 | Hybrid phase-shift mask | Physics | 7 | Expired |
| US7354681B2 | Scattering bar OPC application method for sub-half wavelength lithography patterning | Physics | 6 | Active |
| US8395752B2 | Optical imaging writer system | Physics | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.