Tuan Pham
101Patents
17h-index
112Co-inventors
89Inventor score
Filing activity: Dec 17, 1997 → May 26, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9659956B1 | Three-dimensional memory device containing source select gate electrodes with enhanced electrical isolation | Electricity | 74 | Active |
| US5998301A | Method and system for providing tapered shallow trench isolation structure profile | Electricity | 48 | Expired |
| US6261904A | Dual bit isolation scheme for flash devices | Electricity | 39 | Expired |
| US9917093B2 | Inter-plane offset in backside contact via structures for a three-dimensional memory device | Electricity | 32 | Active |
| US10014316B2 | Three-dimensional memory device with leakage reducing support pillar structures and method of making thereof | Electricity | 30 | Active |
| US6867097B1 | Method of making a memory cell with polished insulator layer | Electricity | 29 | Expired |
| US7795080B2 | Methods of forming integrated circuit devices using composite spacer structures | Physics | 28 | Active |
| US8546239B2 | Methods of fabricating non-volatile memory with air gaps | Electricity | 25 | Active |
| US6934772B2 | Lowering display power consumption by dithering brightness | Physics | 24 | Expired |
| US10103161B2 | Offset backside contact via structures for a three-dimensional memory device | Electricity | 23 | Active |
| US9842851B2 | Three-dimensional memory devices having a shaped epitaxial channel portion | Electricity | 22 | Active |
| US8603890B2 | Air gap isolation in non-volatile memory | Electricity | 21 | Active |
| US10283566B2 | Three-dimensional memory device with through-stack contact via structures and method of making thereof | Electricity | 20 | Active |
| US8969206B1 | Triple patterning NAND flash memory with stepped mandrel | Electricity | 20 | Active |
| US9768270B2 | Method of selectively depositing floating gate material in a memory device | Electricity | 19 | Active |
| US7723186B2 | Method of forming memory with floating gates including self-aligned metal nanodots using a coupling layer | Emerging Cross-Sectional Technologies | 18 | Active |
| US8492224B2 | Metal control gate structures and air gap isolation in non-volatile memory | Electricity | 18 | Active |
| US5966618A | Method of forming dual field isolation structures | Electricity | 17 | Expired |
| US7541240B2 | Integration process flow for flash devices with low gap fill aspect ratio | Electricity | 15 | Expired |
| US7183153B2 | Method of manufacturing self aligned non-volatile memory cells | Electricity | 14 | Expired |
| US7582529B2 | Methods of fabricating non-volatile memory with integrated peripheral circuitry and pre-isolation memory cell formation | Electricity | 14 | Active |
| US7362615B2 | Methods for active boosting to minimize capacitive coupling effect between adjacent gates of flash memory devices | Electricity | 14 | Expired |
| US7504686B2 | Self-aligned non-volatile memory cell | Electricity | 14 | Active |
| US6465303B1 | Method of manufacturing spacer etch mask for silicon-oxide-nitride-oxide-silicon (SONOS) type nonvolatile memory | Electricity | 13 | Expired |
| US7482223B2 | Multi-thickness dielectric for semiconductor memory | Electricity | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.