Da-Jun Lin
48Patents
1h-index
28Co-inventors
49Inventor score
Filing activity: Jun 18, 2018 → May 9, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10665546B1 | Semiconductor device and method to fabricate the semiconductor device | Electricity | 8 | Active |
| US12014995B2 | Warpage-reducing semiconductor structure and fabricating method of the same | Electricity | 1 | Active |
| US12089512B2 | Semiconductor structure | Electricity | 1 | Active |
| US11808633B2 | Infrared thermopile sensor | Electricity | 1 | Active |
| US11793091B2 | Semiconductor structure and manufacturing method thereof | Electricity | 1 | Active |
| US11818960B2 | Semiconductor device and method for fabricating the same | Electricity | 1 | Active |
| US11101324B2 | Memory cell and forming method thereof | Electricity | 1 | Active |
| US12376323B2 | Semiconductor structure and the forming method thereof | Electricity | 0 | Active |
| US10692758B1 | Semiconductor device and method to fabricate the semiconductor device | Electricity | 0 | Active |
| US12108691B2 | Manufacturing method of memory device | Electricity | 0 | Active |
| US11114612B2 | Magnetoresistive random access memory and method for fabricating the same | Electricity | 0 | Active |
| US11632889B2 | Method of forming memory cell | Electricity | 0 | Active |
| US11849649B2 | Method for fabricating memory cell of magnetoresistive random access memory | Electricity | 0 | Active |
| US10847465B2 | Semiconductor device and method to fabricate the semiconductor device | Electricity | 0 | Active |
| US12069960B2 | Magnetic random access memory structure | Electricity | 0 | Active |
| US11258005B2 | Magnetoresistive random access memory device and method for fabricating the same | Electricity | 0 | Active |
| US11605777B2 | MRAM structure and method of fabricating the same | Electricity | 0 | Active |
| US11810818B2 | Metal interconnect structure and method for fabricating the same | Electricity | 0 | Active |
| US11094900B2 | Semiconductor device and method for fabricating the same | Electricity | 0 | Active |
| US11462513B2 | Chip bonding alignment structure, chip bonding structure and methods for fabricating the same | Electricity | 0 | Active |
| US11688790B2 | HEMT and method of fabricating the same | Electricity | 0 | Active |
| US11049765B2 | Semiconductor device | Electricity | 0 | Active |
| US12207475B2 | Semiconductor device and method for fabricating the same | Electricity | 0 | Active |
| US11676920B2 | Semiconductor device and method for fabricating the same | Electricity | 0 | Active |
| US11871677B2 | Method for fabricating semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.