Janmye Sung
34Patents
17h-index
23Co-inventors
77Inventor score
Filing activity: Sep 29, 1989 → Dec 6, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5943581A | Method of fabricating a buried reservoir capacitor structure for high-density dynamic random access memory (DRAM) circuits | Electricity | 266 | Expired |
| US5858831A | Process for fabricating a high performance logic and embedded dram devices on a single semiconductor chip | Electricity | 83 | Expired |
| US5550078A | Reduced mask DRAM process | Electricity | 62 | Expired |
| US6008084A | Method for fabricating low resistance bit line structures, along with bit line structures exhibiting low bit line to bit line coupling capacitance | Electricity | 50 | Expired |
| US5879986A | Method for fabrication of a one gigabit capacitor over bit line DRAM cell with an area equal to eight times the used minimum feature | Electricity | 48 | Expired |
| US6136643A | Method for fabricating capacitor-over-bit-line dynamic random access memory (DRAM) using self-aligned contact etching technology | Electricity | 46 | Expired |
| US5559360A | Inductor for high frequency circuits | Electricity | 46 | Expired |
| US5547893A | method for fabricating an embedded vertical bipolar transistor and a memory cell | Electricity | 46 | Expired |
| US5153145A | FET with gate spacer | Electricity | 46 | Expired |
| US5470783A | Method for integrated circuit device isolation | Emerging Cross-Sectional Technologies | 42 | Expired |
| US5792680A | Method of forming a low cost DRAM cell with self aligned twin tub CMOS devices and a pillar shaped capacitor | Electricity | 29 | Expired |
| US6008085A | Design and a novel process for formation of DRAM bit line and capacitor node contacts | Electricity | 29 | Expired |
| US6180453A | Method to fabricate a DRAM cell with an area equal to five times the minimum used feature, squared | Electricity | 29 | Expired |
| US5679589A | FET with gate spacer | Electricity | 25 | Expired |
| US5821142A | Method for forming a capacitor with a multiple pillar structure | Emerging Cross-Sectional Technologies | 24 | Expired |
| US5753551A | Memory cell array with a self-aligned, buried bit line | Electricity | 24 | Expired |
| US5789291A | Dram cell capacitor fabrication method | Electricity | 21 | Expired |
| US6137130A | Capacitor over bit line structure using a straight bit line shape | Electricity | 14 | Expired |
| US5573962A | Low cycle time CMOS process | Electricity | 14 | Expired |
| US6025227A | Capacitor over bit line structure using a straight bit line shape | Electricity | 13 | Expired |
| US5002898A | Integrated-circuit device isolation | Electricity | 12 | Expired |
| US4999317A | Metallization processing | Electricity | 12 | Expired |
| US5808335A | Reduced mask DRAM process | Electricity | 12 | Expired |
| US5353245A | Memory integrated circuit with balanced resistance | Emerging Cross-Sectional Technologies | 10 | Expired |
| US5879997A | Method for forming self aligned polysilicon contact | Electricity | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.