Junli Wang
437Patents
18h-index
130Co-inventors
89Inventor score
Filing activity: Oct 31, 1997 → Sep 25, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8492228B1 | Field effect transistor devices having thick gate dielectric layers and thin gate dielectric layers | Electricity | 61 | Active |
| US9954058B1 | Self-aligned air gap spacer for nanosheet CMOS devices | Electricity | 47 | Active |
| US9508825B1 | Method and structure for forming gate contact above active area with trench silicide | Electricity | 38 | Active |
| US10566246B1 | Shared contact trench comprising dual silicide layers and dual epitaxial layers for source/drain layers of NFET and PFET devices | Electricity | 29 | Active |
| US10103065B1 | Gate metal patterning for tight pitch applications | Electricity | 29 | Active |
| US9735246B1 | Air-gap top spacer and self-aligned metal gate for vertical fets | Electricity | 28 | Active |
| US9666533B1 | Airgap formation between source/drain contacts and gates | Electricity | 28 | Active |
| US9805935B2 | Bottom source/drain silicidation for vertical field-effect transistor (FET) | Electricity | 27 | Active |
| US9490335B1 | Extra gate device for nanosheet | Emerging Cross-Sectional Technologies | 27 | Active |
| US9799765B1 | Formation of a bottom source-drain for vertical field-effect transistors | Electricity | 25 | Active |
| US9748380B1 | Vertical transistor including a bottom source/drain region, a gate structure, and an air gap formed between the bottom source/drain region and the gate structure | Physics | 25 | Active |
| US10020254B1 | Integration of super via structure in BEOL | Electricity | 25 | Active |
| US8857209B2 | Apparatus for carrying/storing baked goods and the like | Performing Operations; Transporting | 22 | Active |
| US9741792B2 | Bulk nanosheet with dielectric isolation | Electricity | 22 | Active |
| US9842931B1 | Self-aligned shallow trench isolation and doping for vertical fin transistors | Electricity | 21 | Active |
| US8546209B1 | Replacement metal gate processing with reduced interlevel dielectric layer etch rate | Electricity | 20 | Active |
| US9576980B1 | FinFET devices having gate dielectric structures with different thicknesses on same semiconductor structure | Electricity | 19 | Active |
| US9768118B1 | Contact having self-aligned air gap spacers | Electricity | 19 | Active |
| US10020255B1 | Integration of super via structure in BEOL | Electricity | 18 | Active |
| US9704990B1 | Vertical FET with strained channel | Electricity | 16 | Active |
| US9653575B1 | Vertical transistor with a body contact for back-biasing | Electricity | 16 | Active |
| US9276013B1 | Integrated formation of Si and SiGe fins | Electricity | 16 | Active |
| US9911738B1 | Vertical-transport field-effect transistors with a damascene gate strap | Electricity | 15 | Active |
| US9570555B1 | Source and drain epitaxial semiconductor material integration for high voltage semiconductor devices | Electricity | 15 | Active |
| US7538390B2 | Semiconductor device with PMOS and NMOS transistors | Electricity | 15 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.