Murat Kerem Akarvardar
58Patents
10h-index
45Co-inventors
74Inventor score
Filing activity: May 31, 2013 → Jun 30, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9343300B1 | Methods of forming source/drain regions for a PMOS transistor device with a germanium-containing channel region | Electricity | 24 | Active |
| US9929157B1 | Tall single-fin fin-type field effect transistor structures and methods | Electricity | 21 | Active |
| US9165837B1 | Method to form defect free replacement fins by H2 anneal | Electricity | 20 | Active |
| US10217846B1 | Vertical field effect transistor formation with critical dimension control | Electricity | 14 | Active |
| US9576857B1 | Method and structure for SRB elastic relaxation | Electricity | 11 | Active |
| US9224865B2 | FinFET with insulator under channel | Electricity | 11 | Active |
| US9117875B2 | Methods of forming isolated germanium-containing fins for a FinFET semiconductor device | Electricity | 11 | Active |
| US9006077B2 | Gate length independent silicon-on-nothing (SON) scheme for bulk FinFETs | Electricity | 10 | Active |
| US9252245B1 | Spacer-last replacement metal gate flow and device | Electricity | 10 | Active |
| US9147616B1 | Methods of forming isolated fins for a FinFET semiconductor device with alternative channel materials | Electricity | 10 | Active |
| US9385233B2 | Bulk finFET with partial dielectric isolation featuring a punch-through stopping layer under the oxide | Electricity | 9 | Active |
| US9716174B2 | Electrical isolation of FinFET active region by selective oxidation of sacrificial layer | Electricity | 9 | Active |
| US9324617B1 | Methods of forming elastically relaxed SiGe virtual substrates on bulk silicon | Electricity | 5 | Active |
| US9245980B2 | Methods of forming substantially defect-free, fully-strained silicon-germanium fins for a FinFET semiconductor device | Electricity | 5 | Active |
| US9293587B2 | Forming embedded source and drain regions to prevent bottom leakage in a dielectrically isolated fin field effect transistor (FinFET) device | Electricity | 5 | Active |
| US10297597B2 | Composite isolation structures for a fin-type field effect transistor | Electricity | 4 | Active |
| US9564486B2 | Self-aligned dual-height isolation for bulk FinFET | Electricity | 4 | Active |
| US9362361B1 | Methods of forming elastically relaxed SiGe virtual substrates on bulk silicon | Electricity | 4 | Active |
| US9324790B2 | Self-aligned dual-height isolation for bulk FinFET | Electricity | 4 | Active |
| US8963259B2 | Device isolation in finFET CMOS | Electricity | 4 | Active |
| US9589849B2 | Methods of modulating strain in PFET and NFET FinFET semiconductor devices | Electricity | 3 | Active |
| US9530869B2 | Methods of forming embedded source/drain regions on finFET devices | Electricity | 3 | Active |
| US9570588B2 | Methods of forming transistor structures including forming channel material after formation processes to prevent damage to the channel material | Electricity | 3 | Active |
| US9287130B1 | Method for single fin cuts using selective ion implants | Electricity | 3 | Active |
| US9601383B1 | FinFET fabrication by forming isolation trenches prior to fin formation | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.