Srinath Krishnan
51Patents
17h-index
33Co-inventors
80Inventor score
Filing activity: Dec 19, 1997 → Dec 18, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6184112A | Method of forming a MOSFET transistor with a shallow abrupt retrograde dopant profile | Electricity | 127 | Expired |
| US6060364A | Fast Mosfet with low-doped source/drain | Electricity | 124 | Expired |
| US6087208A | Method for increasing gate capacitance by using both high and low dielectric gate material | Electricity | 106 | Expired |
| US6955969B2 | Method of growing as a channel region to reduce source/drain junction capacitance | Electricity | 88 | Expired |
| US5960322A | Suppression of boron segregation for shallow source and drain junctions in semiconductors | Emerging Cross-Sectional Technologies | 53 | Expired |
| US6509613B1 | Self-aligned floating body control for SOI device through leakage enhanced buried oxide | Electricity | 51 | Expired |
| US6548361B1 | SOI MOSFET and method of fabrication | Electricity | 49 | Expired |
| US6611023B1 | Field effect transistor with self alligned double gate and method of forming same | Electricity | 46 | Expired |
| US6466082B1 | Circuit technique to deal with floating body effects | Electricity | 45 | Expired |
| US6204138A | Method for fabricating a MOSFET device structure which facilitates mitigation of junction capacitance and floating body effects | Electricity | 37 | Expired |
| US6512244B1 | SOI device with structure for enhancing carrier recombination and method of fabricating same | Electricity | 35 | Expired |
| US6100558A | Semiconductor device having enhanced gate capacitance by using both high and low dielectric materials | Electricity | 26 | Expired |
| US7071044B1 | Method of making a test structure for gate-body current and direct extraction of physical gate length using conventional CMOS | Electricity | 20 | Expired |
| US6713819B1 | SOI MOSFET having amorphized source drain and method of fabrication | Electricity | 19 | Expired |
| US6589823B1 | Silicon-on-insulator (SOI)electrostatic discharge (ESD) protection device with backside contact plug | Electricity | 18 | Expired |
| US6362063B1 | Formation of low thermal budget shallow abrupt junctions for semiconductor devices | Electricity | 18 | Expired |
| US6238960A | Fast MOSFET with low-doped source/drain | Electricity | 17 | Expired |
| US6399452B1 | Method of fabricating transistors with low thermal budget | Electricity | 15 | Expired |
| US6441433B1 | Method of making a multi-thickness silicide SOI device | Electricity | 15 | Expired |
| US6420767B1 | Capacitively coupled DTMOS on SOI | Electricity | 15 | Expired |
| US6498371B1 | Body-tied-to-body SOI CMOS inverter circuit | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6492209B1 | Selectively thin silicon film for creating fully and partially depleted SOI on same wafer | Electricity | 14 | Expired |
| US6462381B1 | Silicon-on-insulator (SOI) electrostatic discharge (ESD) protection device with backside contact opening | Electricity | 12 | Expired |
| US6429083B1 | Removable spacer technology using ion implantation to augment etch rate differences of spacer materials | Electricity | 11 | Expired |
| US6429054B1 | Method of fabricating semiconductor-on-insulator (SOI) device with hyperabrupt source/drain junctions | Electricity | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.