Yi Qi
48Patents
9h-index
82Co-inventors
70Inventor score
Filing activity: Feb 16, 2011 → Feb 27, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8439708B2 | Electrical connector with cantilevered arm integrally formed on metal shell | Electricity | 21 | Active |
| US10163635B1 | Asymmetric spacer for preventing epitaxial merge between adjacent devices of a semiconductor and related method | Electricity | 17 | Active |
| US10217846B1 | Vertical field effect transistor formation with critical dimension control | Electricity | 14 | Active |
| US8152566B1 | Electrical connector with resilient arm configured in fixed ended beam manner formed on metal shell | Electricity | 14 | Active |
| US9397200B2 | Methods of forming 3D devices with dielectric isolation and a strained channel region | Electricity | 12 | Active |
| US9524908B2 | Methods of removing portions of fins by preforming a selectively etchable material in the substrate | Electricity | 11 | Active |
| US10170473B1 | Forming long channel FinFET with short channel vertical FinFET and related integrated circuit | Electricity | 11 | Active |
| US9123627B1 | Methods of forming alternative material fins with reduced defect density for a FinFET semiconductor device | Electricity | 10 | Active |
| US9887094B1 | Methods of forming EPI semiconductor material on the source/drain regions of a FinFET device | Electricity | 10 | Active |
| US9431539B2 | Dual-strained nanowire and FinFET devices with dielectric isolation | Electricity | 9 | Active |
| US10249538B1 | Method of forming vertical field effect transistors with different gate lengths and a resulting structure | Electricity | 8 | Active |
| US10446483B2 | Metal-insulator-metal capacitors with enlarged contact areas | Electricity | 7 | Active |
| US10559656B2 | Wrap-all-around contact for nanosheet-FET and method of forming same | Electricity | 6 | Active |
| US10381459B2 | Transistors with H-shaped or U-shaped channels and method for forming the same | Electricity | 6 | Active |
| US9224605B2 | Forming alternative material fins with reduced defect density by performing an implantation/anneal defect generation process | Electricity | 5 | Active |
| US10068810B1 | Multiple Fin heights with dielectric isolation | Electricity | 5 | Active |
| US9502638B2 | Method of manufacturing flexible piezoelectric structures | Emerging Cross-Sectional Technologies | 4 | Active |
| US10211147B2 | Metal-insulator-metal capacitors with dielectric inner spacers | Electricity | 4 | Active |
| US10050125B1 | Vertical-transport field-effect transistors with an etched-through source/drain cavity | Electricity | 4 | Active |
| US9478663B2 | FinFET device including a uniform silicon alloy fin | Electricity | 3 | Active |
| US9099525B2 | Blanket EPI super steep retrograde well formation without Si recess | Electricity | 3 | Active |
| US9391140B2 | Raised fin structures and methods of fabrication | Electricity | 3 | Active |
| US9837268B2 | Raised fin structures and methods of fabrication | Electricity | 2 | Active |
| US10297675B1 | Dual-curvature cavity for epitaxial semiconductor growth | Electricity | 1 | Active |
| US10756184B2 | Faceted epitaxial source/drain regions | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.