Emmanuel Augendre
31Patents
4h-index
34Co-inventors
63Inventor score
Filing activity: Oct 30, 2002 → Dec 15, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8853785B2 | Integrated circuit with electrostatically coupled MOS transistors and method for producing such an integrated circuit | Electricity | 179 | Active |
| US6855605B2 | Semiconductor device with selectable gate thickness and method of manufacturing such devices | Electricity | 20 | Expired |
| US10217849B2 | Method for making a semiconductor device with nanowire and aligned external and internal spacers | Electricity | 6 | Active |
| US10269930B2 | Method for producing a semiconductor device with self-aligned internal spacers | Electricity | 4 | Active |
| US10431683B2 | Method for making a semiconductor device with a compressive stressed channel | Electricity | 3 | Active |
| US10217842B2 | Method for making a semiconductor device with self-aligned inner spacers | Electricity | 3 | Active |
| US10600786B2 | Method for fabricating a device with a tensile-strained NMOS transistor and a uniaxial compression strained PMOS transistor | Electricity | 2 | Active |
| US9853124B2 | Method for fabricating a nanowire semiconductor transistor having an auto-aligned gate and spacers | Electricity | 2 | Active |
| US9704709B2 | Method for causing tensile strain in a semiconductor film | Electricity | 2 | Active |
| US10141424B2 | Method of producing a channel structure formed from a plurality of strained semiconductor bars | Electricity | 2 | Active |
| US9536951B2 | FinFET transistor comprising portions of SiGe with a crystal orientation [111] | Electricity | 1 | Active |
| US10109735B2 | Process for fabricating a field effect transistor having a coating gate | Electricity | 1 | Active |
| US8809964B2 | Method of adjusting the threshold voltage of a transistor by a buried trapping layer | Electricity | 1 | Active |
| US10714392B2 | Optimizing junctions of gate all around structures with channel pull back | Electricity | 1 | Active |
| US10134875B2 | Method for fabricating a transistor having a vertical channel having nano layers | Electricity | 1 | Active |
| US11688811B2 | Transistor comprising a channel placed under shear strain and fabrication process | Electricity | 0 | Active |
| US7879690B2 | Method of fabricating a microelectronic structure of a semiconductor on insulator type with different patterns | Electricity | 0 | Active |
| US11848191B2 | RF substrate structure and method of production | Electricity | 0 | Active |
| US11450755B2 | Electronic device including at least one nano-object | Electricity | 0 | Active |
| US9917153B2 | Method for producing a microelectronic device | Electricity | 0 | Active |
| US12119258B2 | Semiconductor structure comprising a buried porous layer for RF applications | Electricity | 0 | Active |
| US10665497B2 | Method of manufacturing a structure having one or several strained semiconducting zones that may for transistor channel regions | Electricity | 0 | Active |
| US10818775B2 | Method for fabricating a field-effect transistor | Electricity | 0 | Active |
| US10147788B2 | Process for fabricating a field effect transistor having a coating gate | Electricity | 0 | Active |
| US10256102B2 | Method for fabricating a field effect transistor having a surrounding grid | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.