Manfred Horstmann
84Patents
15h-index
38Co-inventors
84Inventor score
Filing activity: Feb 5, 1999 → Feb 26, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7442971B2 | Self-biasing transistor structure and an SRAM cell having less than six transistors | Electricity | 126 | Expired |
| US6881641B2 | Semiconductor device having a retrograde dopant profile in a channel region and method for fabricating the same | Electricity | 125 | Expired |
| US7297994B2 | Semiconductor device having a retrograde dopant profile in a channel region | Electricity | 118 | Active |
| US6274894A | Low-bandgap source and drain formation for short-channel MOS transistors | Electricity | 114 | Expired |
| US6255703A | Device with lower LDD resistance | Electricity | 47 | Expired |
| US6838363B2 | Circuit element having a metal silicide region thermally stabilized by a barrier diffusion material | Electricity | 28 | Expired |
| US6566718B2 | Field effect transistor with an improved gate contact and method of fabricating the same | Electricity | 26 | Expired |
| US6133124A | Device improvement by source to drain resistance lowering through undersilicidation | Electricity | 24 | Expired |
| US7399663B2 | Embedded strain layer in thin SOI transistors and a method of forming the same | Electricity | 23 | Active |
| US6352885B1 | Transistor having a peripherally increased gate insulation thickness and a method of fabricating the same | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6242776A | Device improvement by lowering LDD resistance with new silicide process | Electricity | 19 | Expired |
| US7741167B2 | Semiconductor device comprising NMOS and PMOS transistors with embedded Si/Ge material for creating tensile and compressive strain | Electricity | 18 | Active |
| US7060549B1 | SRAM devices utilizing tensile-stressed strain films and methods for fabricating the same | Electricity | 17 | Expired |
| US7579262B2 | Different embedded strain layers in PMOS and NMOS transistors and a method of forming the same | Electricity | 16 | Active |
| US7329571B2 | Technique for providing multiple stress sources in NMOS and PMOS transistors | Electricity | 15 | Active |
| US6218250A | Method and apparatus for minimizing parasitic resistance of semiconductor devices | Electricity | 14 | Expired |
| US7906383B2 | Stress transfer in an interlayer dielectric by providing a stressed dielectric layer above a stress-neutral dielectric material in a semiconductor device | Electricity | 13 | Active |
| US7659213B2 | Transistor having an embedded tensile strain layer with reduced offset to the gate electrode and a method for forming the same | Electricity | 13 | Active |
| US7547610B2 | Method of making a semiconductor device comprising isolation trenches inducing different types of strain | Electricity | 12 | Active |
| US7208397B2 | Transistor having an asymmetric source/drain and halo implantation region and a method of forming the same | Electricity | 12 | Expired |
| US6541863B1 | Semiconductor device having a reduced signal processing time and a method of fabricating the same | Electricity | 11 | Expired |
| US6207563A | Low-leakage CoSi2-processing by high temperature thermal processing | Electricity | 10 | Expired |
| US6344397B1 | Semiconductor device having a gate electrode with enhanced electrical characteristics | Electricity | 10 | Expired |
| US7217657B2 | Semiconductor device having different metal silicide portions and method for fabricating the semiconductor device | Electricity | 9 | Expired |
| US6821887B2 | Method of forming a metal silicide gate in a standard MOS process sequence | Electricity | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.