Yasushi Urakami
35Patents
4h-index
36Co-inventors
63Inventor score
Filing activity: Oct 27, 2000 → Apr 7, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6495294B1 | Method for manufacturing semiconductor substrate having an epitaxial film in the trench | Electricity | 46 | Expired |
| US6495883B2 | Trench gate type semiconductor device and method of manufacturing | Electricity | 38 | Expired |
| US6406982B2 | Method of improving epitaxially-filled trench by smoothing trench prior to filling | Electricity | 15 | Expired |
| US7564095B2 | Semiconductor device and method for manufacturing the same | Electricity | 5 | Active |
| US10121862B2 | Switching device and method of manufacturing the same | Electricity | 4 | Active |
| US10243035B2 | Method of manufacturing switching element | Electricity | 3 | Active |
| US10056374B2 | Switching device | Electricity | 2 | Active |
| US10170470B2 | Switching device | Electricity | 2 | Active |
| US7063751B2 | Semiconductor substrate formed by epitaxially filling a trench in a semiconductor substrate with a semiconductor material after smoothing the surface and rounding the corners | Electricity | 2 | Expired |
| US6642577B2 | Semiconductor device including power MOSFET and peripheral device and method for manufacturing the same | Electricity | 2 | Expired |
| US7838995B2 | Semiconductor device having p-n column portion | Electricity | 1 | Active |
| US9048102B2 | SiC single crystal, SiC wafer, and semiconductor device | Electricity | 1 | Active |
| US8936682B2 | Method of manufacturing homogeneous silicon carbide single crystal with low potential of generating defects | Electricity | 1 | Active |
| US9166008B2 | SiC single crystal, SiC wafer, and semiconductor device | Electricity | 1 | Active |
| US10985241B2 | Semiconductor device and production method thereof | Electricity | 0 | Active |
| US9534317B2 | Seed crystal for SiC single-crystal growth, SiC single crystal, and method of manufacturing the SiC single crystal | Emerging Cross-Sectional Technologies | 0 | Active |
| US10263071B2 | Method of manufacturing semiconductor device | Electricity | 0 | Active |
| US10326015B2 | Switching element and method of manufacturing the same | Electricity | 0 | Active |
| US10522627B2 | Semiconductor device | Electricity | 0 | Active |
| US10204980B2 | Semiconductor device and manufacturing method of the same | Electricity | 0 | Active |
| US10125435B2 | SiC single crystal, SiC wafer, SiC substrate, and SiC device | Chemistry; Metallurgy | 0 | Active |
| US11004765B2 | Field-effect transistor with a heat absorber in contact with a surface of the gate electrode on its back side | Electricity | 0 | Active |
| US10236338B2 | SiC single crystal seed, SiC ingot, SiC single crystal seed production method, and SiC single crystal ingot production method | Chemistry; Metallurgy | 0 | Active |
| US9145622B2 | Manufacturing method of silicon carbide single crystal | Chemistry; Metallurgy | 0 | Active |
| US11393902B2 | Semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.